【Trackless Planar Design】Features a trackless planar structure with free clamping, eliminating traditional rails for smoother and more reliable operation.
【Screw-Free Pressing Mechanism】Abandons the traditional screw design, enabling one-handed pressing with a simple press-to-open and release-to-lock action.
【CNC Precision Construction】Manufactured with CNC precision integrated molding for durable and reliable performance in demanding repair tasks.
【Max 21x46mm Clamping Area】Supports a maximum clamping size of 21mm x 46mm, accommodating a wide range of BGA, CPU, and IC chip packages.
【Versatile Chip Repair Tool】Specifically designed for removing glue and repairing pins on BGA, CPU, IC, and other encapsulated chip packages.
