RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 1
RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 2
RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 3
RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 4
RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 5
RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 6
RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 7
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RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 1RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 2RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 3RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 4RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 5RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 6RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools - 7

RELIFE RL-044 58Pcs Android Series Chip Planting Tin Steel Mesh Set Phones Repair Tools

SKU: 661601013A
Price:
R 990.00

Payment & Security

Description

  • Support Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos/BGA/Android and other series. Applicable to ACU/EMMC/EXC/HIC/MTC/SMC series, etc.
  • Use mobile phones for actual measurement to ensure accuracy. Each mesh is calibrated according tothe mobile phone drawings to ensure that every solder joint is indispensable
  • It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
  • UItra thin design, better fit of tin planting, continuous bending and full toughness

Specifications:

  • Product: Android series chip planting tin steel stencil set
  • Model: RL-044
  • Net weight: about 130g
  • Size: 50 * 50 * 0.12/0.15mm
  • Thickness: 0.12 /0.15mm (EMMC series)
  • Quantity: 58pcs/box

In the box

  • 4 x ACU
  • 6 x EMMC
  • 9 x HIC
  • 11 x MTC
  • 21 x SMC
  • 7 x EXC
  • Other items not included

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