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Description
- 【Lead-Silver Composition】 Contains lead and silver for enhanced conductivity and strength in solder joints
- 【Medium Temperature Formula】 Optimized for 183°C soldering, protecting temperature-sensitive components
- 【Excellent Wettability】 Provides superior wetting properties for improved solder flow and coverage
- 【High Yield Performance】 Easy to print with minimal tin bridging, resulting in high production yields
- 【No-Clean Formula】 Eliminates the need for post-soldering cleaning, streamlining the production process
- 【Oxidation Resistant】 Offers resistance to oxidation, ensuring long-lasting and reliable solder joints
- 【Syringe Design】 Convenient 10CC syringe packaging for precise application and easy handling
Specifications:
- Melting Point: 183°C
- Packaging: 10CC syringe
- Solder Type: Lead-silver alloy
- Application: Medium temperature soldering
- Features: No-clean, oxidation resistant, high conductivity
- Suitable for: Temperature-sensitive components
- Performance: High yield, minimal bridging
- Finish: Bright and full solder joints
In the box
- 1 x Syringe Design Solder Paste