RELIFE HW21 Medium Temperature Solder Paste 40G / 183-Degree Melting Point for Electronics Soldering (Containing Leaded Silver)


Price:
Sale priceR 290.00

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Description

  • 【Lead-Silver Solder Paste】 Contains lead and silver for strong conductivity and improved strength in solder joints
  • 【Optimized Medium-Temperature Welding】 183℃ melting point protects temperature-sensitive components while ensuring high-quality connections
  • 【Excellent Wettability】 Provides superior spreading and adhesion for reliable solder joints
  • 【High Yield Performance】 Easy to print with minimal tin bridging, resulting in high production yield rates
  • 【No-Clean Formula】 Eliminates the need for post-soldering cleaning, saving time and resources in the manufacturing process

Specifications:

  • Melting Point: 183℃
  • Quantity: 40G
  • Composition: Lead and silver content
  • Viscosity: Moderate
  • Oxidation Resistance: Yes
  • Solder Joint Appearance: Bright and full
  • Paste Consistency: Fine, no collapse or deviation
  • Application Range: Wide

In the box

  • 1 x Solder Paste

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