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Description
- 【Medium Melting Point】Melts at 183℃, ideal for temperature-sensitive electronic repairs, including smartphones and PCB components
- 【Strong Soldering Power】Delivers excellent adhesion with fine and even tin beads, ensuring stable and reliable joints
- 【Enhanced Conductivity】Upgraded silver-infused formula significantly improves conductivity and reduces false soldering
- 【Smooth & Uniform Texture】Fine and sticky consistency prevents tin bubbling and ensures uniform solder ball formation
- 【High Efficiency Formula】High resistance and durability with strong welding performance, designed for precision micro-soldering tasks
Specifications:
- Melting Point: 183℃
- Microns: 20 - 38um
- Storage: 0 - 10℃
- Type: Medium-temperature solder paste
- Application: Electronic component soldering
In the box
- 1 x Medium Temperature Solder Paste