【Strong Magnetic Adsorption】Powerful magnetic system ensures precise chip positioning and prevents movement during the tin plating process for reliable BGA repair operations.
【One-Step Maintenance】Streamlined design enables quick and easy chip installation and maintenance without complex fixture adjustments, simply close to complete chip securing.
【Universal Chip Compatibility】Supports multiple series including IP, Hisilicon, Qualcomm chips and general BGA packaged CPUs for versatile repair applications.
【Precision Steel Mesh Positioning】Yellow steel mesh layer ensures accurate alignment with chip pins for high-precision tin plating operations and consistent results.
【Ergonomic Design】Symmetrical groove structure in the blue housing provides comfortable grip and handling during repair work.
【Environmental Protection Materials】Constructed with non-toxic, wear-resistant, high-temperature resistant and anti-aging materials for safe and durable performance.
