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Description
- 【Precision Laser-Cut BGA Stencils】High-precision stainless steel construction with square chamfer design (1/4-1/2 mil) ensures accurate solder ball placement and uniform distribution for professional BGA reballing.
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【Magnetic Power Tin Planting Platform】The magnetic power tin planting platform provides a secure grip, simplifying the reballing process for a wide range of CPUs. - 【Professional-Grade Manufacturing】Constructed from medical-grade 304/316L stainless steel with ±2μm hole precision, ensuring durability and consistent performance in professional repair environments.
- 【Precision Alignment Features】Each stencil includes four corner positioning holes (Φ3.0mm) and center cross-reference marks for accurate chip-to-stencil alignment during repairs.
- 【Chip-Specific Design】Each model features custom aperture patterns matching specific BGA chip layouts, preventing bridging and cold joints while ensuring optimal solder ball distribution.
In the box
- 12 x BGA Reballing Stencil Template Net