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Description
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【High-Precision BGA Reballing Stencils】Professional-grade stencils specifically designed for Samsung series chip reballing with precise hole placement and snug fit for accurate solder ball positioning.
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【Premium Steel Construction】Made from high-quality Japanese stainless steel with 700℃ high-temperature resistance, ensuring durability and long service life without deformation.
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【Ultra-Thin 0.12mm Design】Precision die-cast construction with 0.12mm thickness provides flexibility while maintaining structural integrity for professional IC repair work.
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【Non-Stick Tin Plating Surface】Special tin plating treatment prevents solder adhesion and enables easy removal from circuit boards without leaving cold joints or bridges.
- 【Professional Reballing Solution】Engineered for IC chip repair and rework processes, delivering high yield rates and full solder joints when properly aligned.
Specifications:
- Material: Stainless Steel
- Surface Treatment: Tin Plating
- Thickness: 0.12mm
- Temperature Resistance: Up to 700℃
- Stencil Dimensions: 100mm x 80mm
- Manufacturing Process: Precision Die Casting
In the box
- 10 x BGA IC Solder Reballing Stencils