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Description
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【Professional BGA Reballing Stencil】High-precision solder reballing stencil designed specifically for BGA chip repair and tin ball replacement in professional electronics repair.
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【Premium Stainless Steel】Made from high-grade stainless steel with tin plating surface treatment for superior durability and precision.
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【Ultra-Thin 0.12mm Design】Precision die-casting technology creates ultra-thin 0.12mm thickness with high toughness, ensuring no warping or deformation during use.
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【700℃ High Temperature Resistant】Withstands extreme temperatures up to 700℃ without thermal deformation, perfect for professional soldering applications.
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【Easy Release & Full Solder Joints】Non-stick surface ensures easy removal from PCB boards without leaving empty solder points, achieving full and precise solder ball placement.
Specifications:
- Material: Stainless Steel
- Surface Treatment: Tin Plating
- Thickness: 0.12mm
- Dimensions: 100mm x 80mm
- Temperature Resistance: Up to 700℃
- Chip Models: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17
In the box
- 10 x BGA IC Solder Reballing Stencils