【Hook-Shaped Precision Design】Curved hook tips allow precise access to tight spaces under IC chips and small components for effective adhesive removal.
【Hand Forged Blades】Each blade is hand forged for superior strength and durability, ensuring long-lasting performance in demanding repair tasks.
【High Ductility Construction】Made with high ductility metal for flexibility and resistance to breakage during intensive scraping and prying operations.
【Multi-Purpose Adhesive Removal】Efficiently removes underfill adhesive from phone PCB boards, screens, back covers, and frames during smartphone restoration.
【Handle-Compatible Design】Features a slotted center for secure attachment to compatible handles, making it ideal for professional technicians and DIY repair enthusiasts.
Specifications:
Model: BL01
Blade Type: Hook / Curved
Blade Process: Hand Forged
Material Feature: High Ductility
Application: IC Scraping Glue, Disassemble Small Chip Components
