【Dual-Sided Design】The reball base features a dual-sided design, allowing technicians to process different types of NAND or BGA chips without switching platforms, significantly improving work efficiency.
【Strong Magnetic Fixation】Built-in strong magnets securely hold chips in place, preventing movement during solder paste application or hot air heating. This magnetic stability reduces issues such as solder bridges or misalignment.
【NAND Flash Optimized】The BH16 model is optimized for NAND flash chips, particularly suitable for BGA-type NAND chips used in smartphones and tablets.
【Versatile Compatibility】Includes BGA110 and BGA315 stencils, making it highly compatible with common NAND heights.
【Heat Resistant】The platform can withstand high temperatures from hot air guns and heating stations, maintaining structural integrity and durability for frequent professional use.
【Ergonomic Design】The base features rounded edges for comfortable grip and easy operation.
