1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm - 1
1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm - 2
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1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm - 11 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm - 2

1 Bottle Tin BGA Reballing Soldering Balls for BGA Rework Repair Tools - Diameter: 0.2mm

TVCMall
Price:
R 190.00

Payment & Security

Description

  • Brand new and high quality

  • Solder tin paste is the best choice of reballing IC 

  • It is used instead of the pin in the IC component package structure

Specification:

  • Brand: BEST

  • Model: 505

  • Material: tin

  • Diameter: 0.2mm~0.65mm 

  • Flux content: 63%

  • Melting point: 183°C

  • Working temperature: 200-380°C

  • Quantity: 25,000pcs per bottle

  • Balls alloy: Sn63/Pb37

  • Size: 35x16mm

In the box

  • 1 x 1 Bottle Tin BGA Reballing Soldering Balls

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